AMKOR Technology Inc.

AMKOR Technology Inc. AMKR

Dividend Summary

The next AMKOR Technology Inc. dividend went ex 9 days ago for 7.88c and will be paid in 11 days.
The previous AMKOR Technology Inc. dividend was 7.88c and it went ex 3 months ago and it was paid 2 months ago.
There are typically 4 dividends per year (excluding specials).

Latest Dividends
Summary Previous dividend Next dividend
Status Paid Declared
Type Quarterly Quarterly
Per share 7.88c 7.88c
Declaration date 20 Feb 2024 (Tue) 14 May 2024 (Tue)
Ex-div date 11 Mar 2024 (Mon) 04 Jun 2024 (Tue)
Pay date 01 Apr 2024 (Mon) 24 Jun 2024 (Mon)

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Previous Payment
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Forecast Accuracy
92%
Our premium tools have predicted AMKOR Technology Inc. with 92% accuracy.
Dividend Yield Today
1.1%
The dividend yield is calculated by dividing the annual dividend payment by the prevailing share price
The table below shows the full dividend history for AMKOR Technology Inc.
Status Type Decl. date Ex-div date Pay date Decl. Currency Forecast amount Decl. amount Accuracy
Forecast Quarterly 08 Aug 2028 29 Aug 2028 18 Sep 2028 USD Sign up
Forecast Quarterly 09 May 2028 30 May 2028 19 Jun 2028 USD Sign up
Forecast Quarterly 15 Feb 2028 07 Mar 2028 27 Mar 2028 USD Sign up
Forecast Quarterly 09 Nov 2027 30 Nov 2027 21 Dec 2027 USD Sign up
Forecast Quarterly 10 Aug 2027 31 Aug 2027 20 Sep 2027 USD Sign up
Forecast Quarterly 11 May 2027 01 Jun 2027 21 Jun 2027 USD Sign up
Forecast Quarterly 16 Feb 2027 09 Mar 2027 29 Mar 2027 USD Sign up
Forecast Quarterly 10 Nov 2026 01 Dec 2026 22 Dec 2026 USD Sign up
Forecast Quarterly 11 Aug 2026 01 Sep 2026 21 Sep 2026 USD Sign up
Forecast Quarterly 12 May 2026 02 Jun 2026 22 Jun 2026 USD Sign up
Forecast Quarterly 17 Feb 2026 10 Mar 2026 30 Mar 2026 USD Sign up
Forecast Quarterly 11 Nov 2025 02 Dec 2025 23 Dec 2025 USD Sign up
Forecast Quarterly 12 Aug 2025 02 Sep 2025 22 Sep 2025 USD Sign up
Forecast Quarterly 13 May 2025 03 Jun 2025 23 Jun 2025 USD Sign up
Forecast Quarterly 18 Feb 2025 11 Mar 2025 31 Mar 2025 USD Sign up
Forecast Quarterly 12 Nov 2024 03 Dec 2024 24 Dec 2024 USD Sign up
Forecast Quarterly 13 Aug 2024 03 Sep 2024 23 Sep 2024 USD Sign up
Declared Quarterly 14 May 2024 04 Jun 2024 24 Jun 2024 USD 7.88c 7.88c 😄
Paid Quarterly 20 Feb 2024 11 Mar 2024 01 Apr 2024 USD 7.88c 7.88c 😄
Paid Quarterly 14 Nov 2023 04 Dec 2023 26 Dec 2023 USD 9.75c 7.88c 😌
Paid Quarterly 15 Aug 2023 01 Sep 2023 25 Sep 2023 USD 7.5c 7.5c 😄
Paid Quarterly 16 May 2023 05 Jun 2023 26 Jun 2023 USD 7.5c
Paid Quarterly 07 Feb 2023 27 Feb 2023 20 Mar 2023 USD 7.5c
Paid Quarterly 15 Nov 2022 05 Dec 2022 27 Dec 2022 USD 7.5c
Paid Quarterly 16 Aug 2022 02 Sep 2022 26 Sep 2022 USD 5c
Paid Quarterly 17 May 2022 06 Jun 2022 27 Jun 2022 USD 5c
Paid Quarterly 08 Feb 2022 28 Feb 2022 21 Mar 2022 USD 5c
Paid Quarterly 16 Nov 2021 06 Dec 2021 28 Dec 2021 USD 5c
Paid Quarterly 17 Aug 2021 03 Sep 2021 30 Sep 2021 USD 4c
Paid Quarterly 18 May 2021 04 Jun 2021 28 Jun 2021 USD 4c
Paid Quarterly 02 Feb 2021 22 Feb 2021 15 Mar 2021 USD 4c
Paid Quarterly 26 Oct 2020 17 Dec 2020 07 Jan 2021 USD 4c
Year Amount Change
2006 0.0c
2007 0.0c
0%
2008 0.0c
0%
2009 0.0c
0%
2010 0.0c
0%
2011 0.0c
0%
2012 0.0c
0%
2013 0.0c
0%
2014 0.0c
0%
2015 0.0c
0%
2016 0.0c
0%
2017 0.0c
0%
2018 0.0c
0%
2019 0.0c
0%
2020 16.0c
100%
2021 20.0c
25.0%
2022 30.0c
50.0%
2023 31.52c
5.1%
2024 Sign Up Required
2025 Sign Up Required
2026 Sign Up Required
2027 Sign Up Required

AMKOR Technology Inc. Optimized Dividend Chart

The chart below shows the optimized dividends for this security over a rolling 12-month period.
Dividend Yield Today
1.1%
Optimized Yield
Sign Up Required
52 Week High
2.4% on 30 October 2023
52 Week Low
1.0% on 14 December 2023
Next Ex-Div-Date Countdown
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About AMKOR Technology Inc.

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services. The company provides flip chip-scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages includes power management, transceivers, radar, and specialty silicon for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. Additionally, it offers micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Sector
Technology Hardware & Equipment
Country
United States
Share Price
$35.62 (yesterday's closing price)
Shares in Issue
246 million
Market Cap
$8.8bn
CADI
The Consecutive Annual Dividend Increases - the number of years this company has been increasing its dividends
3
Market Indices
none
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