AMKOR Technology Inc. AMKR
The next AMKOR Technology Inc. dividend went ex 6 days ago for 7.88c and will be paid in 16 days.
The previous AMKOR Technology Inc. dividend was 7.5c and it went ex 3 months ago and it was paid 3 months ago.
There are typically 4 dividends per year (excluding specials).
|Summary||Previous dividend||Next dividend|
|Declaration date||15 Aug 2023 (Tue)||14 Nov 2023 (Tue)|
|Ex-div date||01 Sep 2023 (Fri)||04 Dec 2023 (Mon)|
|Pay date||25 Sep 2023 (Mon)||26 Dec 2023 (Tue)|
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|Status||Type||Decl. date||Ex-div date||Pay date||Decl. Currency||Forecast amount||Decl. amount||Accuracy|
|Forecast||Quarterly||08 Aug 2028||28 Aug 2028||18 Sep 2028||USD||Sign up||—|
|Forecast||Quarterly||09 May 2028||29 May 2028||19 Jun 2028||USD||Sign up||—|
|Forecast||Quarterly||01 Feb 2028||21 Feb 2028||13 Mar 2028||USD||Sign up||—|
|Forecast||Quarterly||09 Nov 2027||29 Nov 2027||21 Dec 2027||USD||Sign up||—|
|Forecast||Quarterly||10 Aug 2027||30 Aug 2027||20 Sep 2027||USD||Sign up||—|
|Forecast||Quarterly||11 May 2027||31 May 2027||21 Jun 2027||USD||Sign up||—|
|Forecast||Quarterly||02 Feb 2027||22 Feb 2027||15 Mar 2027||USD||Sign up||—|
|Forecast||Quarterly||10 Nov 2026||30 Nov 2026||22 Dec 2026||USD||Sign up||—|
|Forecast||Quarterly||11 Aug 2026||31 Aug 2026||21 Sep 2026||USD||Sign up||—|
|Forecast||Quarterly||12 May 2026||01 Jun 2026||22 Jun 2026||USD||Sign up||—|
|Forecast||Quarterly||03 Feb 2026||23 Feb 2026||16 Mar 2026||USD||Sign up||—|
|Forecast||Quarterly||11 Nov 2025||01 Dec 2025||23 Dec 2025||USD||Sign up||—|
|Forecast||Quarterly||12 Aug 2025||29 Aug 2025||22 Sep 2025||USD||Sign up||—|
|Forecast||Quarterly||13 May 2025||02 Jun 2025||23 Jun 2025||USD||Sign up||—|
|Forecast||Quarterly||04 Feb 2025||24 Feb 2025||17 Mar 2025||USD||Sign up||—|
|Forecast||Quarterly||12 Nov 2024||02 Dec 2024||24 Dec 2024||USD||Sign up||—|
|Forecast||Quarterly||13 Aug 2024||30 Aug 2024||23 Sep 2024||USD||Sign up||—|
|Forecast||Quarterly||14 May 2024||03 Jun 2024||24 Jun 2024||USD||Sign up||—|
|Forecast||Quarterly||06 Feb 2024||26 Feb 2024||18 Mar 2024||USD||Sign up||—|
|Declared||Quarterly||14 Nov 2023||04 Dec 2023||26 Dec 2023||USD||9.75c||7.88c||😌|
|Paid||Quarterly||15 Aug 2023||01 Sep 2023||25 Sep 2023||USD||7.5c||7.5c||😄|
|Paid||Quarterly||16 May 2023||05 Jun 2023||26 Jun 2023||USD||—||7.5c|
|Paid||Quarterly||07 Feb 2023||27 Feb 2023||20 Mar 2023||USD||—||7.5c|
|Paid||Quarterly||15 Nov 2022||05 Dec 2022||27 Dec 2022||USD||—||7.5c|
|Paid||Quarterly||16 Aug 2022||02 Sep 2022||26 Sep 2022||USD||—||5c|
|Paid||Quarterly||17 May 2022||06 Jun 2022||27 Jun 2022||USD||—||5c|
|Paid||Quarterly||08 Feb 2022||28 Feb 2022||21 Mar 2022||USD||—||5c|
|Paid||Quarterly||16 Nov 2021||06 Dec 2021||28 Dec 2021||USD||—||5c|
|Paid||Quarterly||17 Aug 2021||03 Sep 2021||30 Sep 2021||USD||—||4c|
|Paid||Quarterly||18 May 2021||04 Jun 2021||28 Jun 2021||USD||—||4c|
|Paid||Quarterly||02 Feb 2021||22 Feb 2021||15 Mar 2021||USD||—||4c|
|Paid||Quarterly||26 Oct 2020||17 Dec 2020||07 Jan 2021||USD||—||4c|
|2023||Sign Up Required|
|2024||Sign Up Required|
|2025||Sign Up Required|
|2026||Sign Up Required|
|2027||Sign Up Required|
AMKOR Technology Inc. Optimized Dividend Chart
About AMKOR Technology Inc.
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services. The company provides flip chip-scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages includes power management, transceivers, radar, and specialty silicon for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. Additionally, it offers micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
- Technology Hardware & Equipment
- United States
- Share Price
- $28.76 (yesterday's closing price)
- Shares in Issue
- 246 million
- Market Cap
- Market Indices