Ansys Inc.

Ansys Inc. ANSS

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Dividend Yield Today
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The table below shows the full dividend history for Ansys Inc.
Status Type Decl. date Ex-div date Pay date Decl. Currency Forecast amount Decl. amount Accuracy
There are no Ansys Inc. dividends.
Year Amount Change
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Ansys Inc. Optimized Dividend Chart

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Dividend Yield Today
0.0%
Optimized Yield
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52 Week High
0.0% on 07 December 2023
52 Week Low
0.0% on 07 December 2023
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About Ansys Inc.

ANSYS, Inc. (ANSYS), incorporated on January 12, 1994, develops and markets engineering simulation software and services used by engineers, designers, researchers and students across a range of industries and academia, including aerospace and defense, automotive, industrial equipment, electronics, biomedical, energy, materials and chemical processing, and semiconductors. The Company focuses on the development of open and flexible solutions that enable users to analyze designs directly on the desktop, providing a common platform for product development, from design concept to final-stage testing and validation. The Company distributes its ANSYS suite of simulation technologies through a network of independent resellers and distributors (collectively, channel partners) and direct sales offices in various locations. The Company's product portfolio consists of Simulation Platform: ANSYS Workbench, Structures, Fluids, Electronics, Semiconductors, Multiphysics, AIM, Embedded Software, Systems, Three Dimensional (3-D) Direct Modeling and Academic.

Simulation Platform: ANSYS Workbench

ANSYS Workbench is the framework upon which the Company's suite of advanced engineering simulation technologies is built. ANSYS Engineering Knowledge Manager (ANSYS EKM) is a solution for simulation-based process and data management challenges. ANSYS EKM provides solutions and benefits to all levels of a company, enabling an organization to address the issues associated with simulation data, including backup and archival, traceability and audit trail, process automation, collaboration and capture of engineering expertise, and intellectual property protection. The high-performance computing (HPC) product suite delivers cross-physics parallel processing capabilities for the spectrum of the Company's simulation software by supporting structures, fluids, thermal and electronics simulations. It offers geometry handling solutions for engineering simulation in an integrated environment with direct interfaces to all computer-aided design (CAD) systems, support of additional readers and translators, and an integrated geometry modeler focused on analysis. With ANSYS ACT, end users or ANSYS partners can modify the user interface, process simulation data or embed third-party applications to create specialized tools based on ANSYS Workbench.

Structures

The Company's structural analysis product suite offers simulation tools for product design and optimization. These tools have capabilities that cover a range of analysis types, elements, contacts, materials, equation solvers and coupled physics capabilities all targeted toward understanding and solving complex design problems. The Company's explicit dynamics product suite simulates events involving short duration, large strain, large deformation, fracture, complete material failure or structural problems with complex interactions. The Company's composite analysis and optimization technology defines materials, plies and stacking sequences. The Company's composite software provides necessary functionalities for finite element analysis of layered composites structures.

Fluids

The Company's fluids product suite enables modeling of fluid flow and other related physical phenomena. Fluid flow analysis capabilities provide all the tools needed to design and optimize new fluids equipment and to troubleshoot already existing installations. The suite contains general-purpose computational fluid dynamics software and specialized products to address specific industry applications.

Electronics

The Company's electronics product suite provides field simulation software for designing high-performance electronic and electromechanical products. The software streamlines the design process and predicts performance of mobile communication and Internet-access devices, broadband networking components and systems, integrated circuits (ICs) and printed circuit boards (PCBs), as well as electromechanical systems, such as automotive components and power electronics equipment.

Semiconductors

The Company's power analysis and optimization software suite manages the power budget, power delivery integrity and power-induced noise in an electronic design, from initial prototyping to system sign-off. These solutions deliver the capacity to handle an entire electronic system, including IC, package and PCB.

Multiphysics

The Company's Workbench framework allows engineers and designers to incorporate the compounding effects of multiple physics into a virtual prototype of their design and simulate its operation under real-world conditions. ANSYS multiphysics software enables engineers and scientists to simulate the interactions between structures, heat transfer, fluids and electronics all within an engineering simulation environment.

AIM

AIM is a single-window application, which integrates structural, fluids and electromagnetics simulation and includes all aspects of the simulation workflow. Its interface and guided workflows are designed for casual simulation users, and its integrated 3-D modeling and optimization tools are for exploring designs early in the product lifecycle.

Embedded Software

The Company's SCADE product suite is a solution for embedded software simulation, code production and automated certification. It has been developed specifically for use in critical systems with high dependability requirements, including aerospace, rail transportation, nuclear, industrial and automotive applications. SCADE software supports the entire development workflow, from requirements analysis and design, through verification, implementation and deployment. SCADE solutions integrate with each other and the rest of the ANSYS product suite, allowing for development optimization and increased communication among team members.

Systems

The Company delivers a system simulation capability that is ideal for the design of automated products. This collaborative environment leverages the Company's multiphysics, multibody dynamics, circuit and embedded software simulation capabilities, enabling users to simulate the complex interactions between components, circuits and control software within a single environment. These technologies provide a view into predicted product performance.

3-D Direct Modeling

The Company's 3-D direct modeling technology provides a CAD-neutral environment to modify and prepare geometry for simulation. This approach allows engineers to reduce the pre-processing step in simulation, and delivers product design insights in the earliest stages of development.

Academic

The Company's academic product suite provides a portfolio of academic products based on several usage tiers, including associate, research and teaching. Each tier includes various noncommercial products that bundle a range of physics and advanced coupled field solver capabilities. The academic product suite provides entry-level tools intended for class demonstrations and hands-on instruction.

Sector
Engineering
Country
United States
Share Price
$344.39 (yesterday's closing price)
Shares in Issue
87 million
Market Cap
$30.1bn
CADI
The Consecutive Annual Dividend Increases - the number of years this company has been increasing its dividends
0
Market Indices
S&P 500
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