LPKF Laser & Electronics AG

LPKF Laser & Electronics AG LPK

Dividend Summary


The previous LPKF Laser & Electronics AG dividend was 10¢ and it went ex 1 year ago and it was paid 1 year ago.
There is typically 1 dividend per year (excluding specials), and the dividend cover is approximately 2.0.

Latest Dividends
Summary Previous dividend Next dividend
Status Paid
Type Final
Per share 10¢
Declaration date 29 Mar 2021 (Mon)
Ex-div date 21 May 2021 (Fri)
Pay date 26 May 2021 (Wed)

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Previous Payment
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Forecast Accuracy
We have not made any dividend predictions for LPKF Laser & Electronics AG
Dividend Yield Today
0.0%
The dividend yield is calculated by dividing the annual dividend payment by the prevailing share price
The table below shows the full dividend history for LPKF Laser & Electronics AG
Status Type Decl. date Ex-div date Pay date Decl. Currency Forecast amount Decl. amount Accuracy
Paid Final 29 Mar 2021 21 May 2021 26 May 2021 EUR 10¢
Paid Final 24 Apr 2020 05 Jun 2020 09 Jun 2020 EUR 10¢
Paid Final 29 May 2015 29 May 2015 EUR 12¢
Paid Final 06 Jun 2014 06 Jun 2014 EUR 25¢
Paid Final 24 May 2013 24 May 2013 EUR 50¢
Year Amount Change
2006 0.0¢
2007 0.0¢
0%
2008 0.0¢
0%
2009 0.0¢
0%
2010 0.0¢
0%
2011 0.0¢
0%
2012 50.0¢
100%
2013 25.0¢
-50.0%
2014 12.0¢
-52.0%
2015 0.0¢
-100.0%
2016 0.0¢
0%
2017 0.0¢
0%
2018 0.0¢
0%
2019 10.0¢
100%
2020 10.0¢
0%

LPKF Laser & Electronics AG Optimized Dividend Chart

The chart below shows the optimized dividends for this security over a rolling 12-month period.
Dividend Yield Today
0.0%
Optimized Yield
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52 Week High
1.4% on 13 May 2022
52 Week Low
0.0% on 19 May 2022
Next Ex-Div-Date Countdown
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About LPKF Laser & Electronics AG

LPKF Laser & Electronics AG is a German-based developer of laser systems and process solutions for printed circuit board (PCB) technology and microelectronics. Its products are aimed at customers in the automotive, electronics, telecommunications and solar sectors. The Group is active in the following segments: Rapid Prototyping offers solutions for the in-house prototyping and assembly of various PCBs without the use of chemicals; Cutting and Structuring Lasers division supplies laser systems and process expertise for the production of interconnect devices; Joining Technologies segment sells laser systems for welding plastic components; Thin-film Technologies segment is involved with the development and production of laser systems for scribing thin-film solar panels and other segments include production services. In December 2013, the Company acquired shares in its Slovenia-based subsidiary, LPKF Laser & Elektronika doo, thus holding 100% of the shares in all of its subsidiaries.

Sector
Electronic & Electrical Equipment
Country
Germany
Share Price
€8.99 (yesterday's closing price)
Shares in Issue
25 million
Market Cap
€220mn
Dividend Cover
How many times is the dividend covered by company income. A cover of 1 means all income is paid out in dividends
2.0
CADI
The Consecutive Annual Dividend Increases - the number of years this company has been increasing its dividends
0
Market Indices
none
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