Be Semiconductor Industries NV BESI
The next Be Semiconductor Industries NV dividend is expected to go ex in 5 months and to be paid in 5 months.
The previous Be Semiconductor Industries NV dividend was 285¢ and it went ex 8 months ago and it was paid 7 months ago.
There is typically 1 dividend per year (excluding specials), and the dividend cover is approximately 2.0.
|Summary||Previous dividend||Next dividend|
|Per share||285¢||Sign Up Required|
|Declaration date||27 Feb 2023 (Mon)||16 Feb 2024 (Fri)|
|Ex-div date||28 Apr 2023 (Fri)||29 Apr 2024 (Mon)|
|Pay date||04 May 2023 (Thu)||03 May 2024 (Fri)|
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|Status||Type||Decl. date||Ex-div date||Pay date||Decl. Currency||Forecast amount||Decl. amount||Accuracy|
|Forecast||Final||11 Feb 2028||02 May 2028||04 May 2028||EUR||Sign up||—|
|Forecast||Final||12 Feb 2027||04 May 2027||06 May 2027||EUR||Sign up||—|
|Forecast||Final||13 Feb 2026||05 May 2026||07 May 2026||EUR||Sign up||—|
|Forecast||Final||14 Feb 2025||06 May 2025||08 May 2025||EUR||Sign up||—|
|Forecast||Final||16 Feb 2024||29 Apr 2024||03 May 2024||EUR||Sign up||—|
|Paid||Final||27 Feb 2023||28 Apr 2023||04 May 2023||EUR||300¢||285¢||😊|
|Paid||Final||18 Feb 2022||03 May 2022||06 May 2022||EUR||175¢||333¢||😖|
|Paid||Final||19 Feb 2021||04 May 2021||07 May 2021||EUR||—||170¢|
|Paid||Final||20 Feb 2020||05 May 2020||08 May 2020||EUR||—||101¢|
|Paid||Final||20 Feb 2019||30 Apr 2019||06 May 2019||EUR||—||167¢|
|Paid||Final||–||30 Apr 2018||04 May 2018||EUR||—||464¢|
|Paid||Special||23 Feb 2017||03 May 2017||08 May 2017||EUR||—||35¢|
|Paid||Final||23 Feb 2017||03 May 2017||08 May 2017||EUR||—||139¢|
|Paid||Special||–||03 May 2016||17 May 2016||EUR||—||20¢|
|Paid||Final||25 Feb 2016||03 May 2016||17 May 2016||EUR||—||100¢|
|Paid||Final||–||05 May 2015||15 May 2015||EUR||—||150¢|
|Paid||Final||–||05 May 2014||16 May 2014||EUR||—||33¢|
|Paid||Final||–||29 Apr 2013||10 May 2013||EUR||—||30¢|
|2023||Sign Up Required|
|2024||Sign Up Required|
|2025||Sign Up Required|
|2026||Sign Up Required|
|2027||Sign Up Required|
Be Semiconductor Industries NV Optimized Dividend Chart
About Be Semiconductor Industries NV
BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
- Electronic & Electrical Equipment
- Share Price
- €133.20 (yesterday's closing price)
- Shares in Issue
- 81 million
- Market Cap
- Market Indices