Be Semiconductor Industries NV BESI
The next Be Semiconductor Industries NV dividend is expected to go ex in 7 months and to be paid in 8 months.
The previous Be Semiconductor Industries NV dividend was 170¢ and it went ex 5 months ago and it was paid 5 months ago.
There is typically 1 dividend per year (excluding specials), and the dividend cover is approximately 2.0.
|Summary||Previous dividend||Next dividend|
|Per share||170¢||Sign Up Required|
|Declaration date||19 Feb 2021 (Fri)||17 Feb 2022 (Thu)|
|Ex-div date||04 May 2021 (Tue)||03 May 2022 (Tue)|
|Pay date||07 May 2021 (Fri)||06 May 2022 (Fri)|
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|Status||Type||Decl. date||Ex-div date||Pay date||Decl. Currency||Forecast amount||Decl. amount||Accuracy|
|Forecast||Final||12 Feb 2026||05 May 2026||07 May 2026||EUR||Sign up||—|
|Forecast||Final||13 Feb 2025||06 May 2025||08 May 2025||EUR||Sign up||—|
|Forecast||Final||15 Feb 2024||29 Apr 2024||03 May 2024||EUR||Sign up||—|
|Forecast||Final||16 Feb 2023||02 May 2023||05 May 2023||EUR||Sign up||—|
|Forecast||Final||17 Feb 2022||03 May 2022||06 May 2022||EUR||Sign up||—|
|Paid||Final||19 Feb 2021||04 May 2021||07 May 2021||EUR||—||170¢|
|Paid||Final||20 Feb 2020||05 May 2020||08 May 2020||EUR||—||101¢|
|Paid||Final||20 Feb 2019||30 Apr 2019||06 May 2019||EUR||—||167¢|
|Paid||Final||–||30 Apr 2018||04 May 2018||EUR||—||464¢|
|Paid||Special||23 Feb 2017||03 May 2017||08 May 2017||EUR||—||35¢|
|Paid||Final||23 Feb 2017||03 May 2017||08 May 2017||EUR||—||139¢|
|Paid||Special||–||03 May 2016||17 May 2016||EUR||—||20¢|
|Paid||Final||25 Feb 2016||03 May 2016||17 May 2016||EUR||—||100¢|
|Paid||Final||–||05 May 2015||15 May 2015||EUR||—||150¢|
|Paid||Final||–||05 May 2014||16 May 2014||EUR||—||33¢|
|Paid||Final||–||29 Apr 2013||10 May 2013||EUR||—||30¢|
|2021||Sign Up Required|
|2022||Sign Up Required|
|2023||Sign Up Required|
|2024||Sign Up Required|
|2025||Sign Up Required|
Be Semiconductor Industries NV Optimized Dividend Chart
About Be Semiconductor Industries NV
BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
- Electronic & Electrical Equipment
- Share Price
- €78.00 (yesterday's closing price)
- Shares in Issue
- 79 million
- Market Cap
- Market Indices